ANNA-B5 Bluetooth® LE module. Built on Nordic Semiconductor’s next-generation wireless SoC, the nRF54L15 chipset with industry-leading processing power and efficiency, this ultra-compact module (6 ...
Trymax Semiconductor Equipment (Trymax) announces the installation of its 500th process chamber in Asia. This milestone reflects continued momentum across key regional markets—including China, Taiwan, ...
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...
RECIF Technologies announced the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With an emphasis on usability, efficiency, and innovation, R.PACK introduces a suite ...
STMicroelectronics and GlobalFoundries announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing ...
In a previously published article, [1], the impact of parasitics on performance was discussed. The eGaN FET outperformed lower voltage rated MOSFETs by combining low figure of merit, low package ...
因為不明的因素，導致網路系統發生錯誤，我們將於最短的時間內更正這個錯誤，麻煩您耐心等待。 若您有緊急的業務需要接洽，研討會報名與雜誌訂閱請來信發行部，廣告事務請接洽產業服務 ...
TAIPEI, Taiwan － TSMC Wednesday signed a cooperation agreement with Taiwan Instrument Technology Research Center (ITRC) in development of Atomic Layer Deposition(ALD) equipment, to elevate the ability ...
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