Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Balazs™ provides analytical services to high-tech ...

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional ...

This white paper discusses the rising complexity of multi-die semiconductor packages, challenges in testing interconnected chips, and how standards like UCIe simplify production testing workflows.

A universal AI & Deep Learning powered model that enhances defect detection in AOI systems for PCBAs and semiconductors, further improving accuracy, speed and consistency - streamlining inspection ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...

Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal ...

AI's rise drives demand for advanced processors, shifting the industry to chiplet architectures with high-bandwidth memory. This transformation introduces new challenges in semiconductor manufacturing ...

Users want to measure various applications on one tool rather than several tools to get the required results. Ultra-precise, non-contact measuring techniques work for a multitude of packaging ...

Advances in vapor chamber technology revolutionize thermal management, delivering up to 12.5°C cooler performance than copper spreaders. These integrated chambers now enhance efficiency in smartphones ...

Lead frame packages are commonly used in semiconductor package fabrication, where interconnections between the integrated circuits (IC) and the metal leads are typically established through die attach ...

In situ hydrogen plasmas are critical for developing 3D chips with dense interconnects and high signal speeds. Atmospheric pressure hydrogen plasma offers a reliable, flux-free method for oxide ...