近日，美国国防高等研究计划署（DARPA）与德克萨斯宣布斥资14亿美元，打造一座面向3D 异构集成的先进封装厂，将负责研究3D异构集成（3DHI）、堆叠和组合等多种材料和芯片类型，以提升美国在军事、国防、AI 和高性能计算的能力。

美国国防高等研究计划署（DARPA）与德州斥资14亿美元，打造一座独特的晶圆厂。这座晶圆厂是对“德州电子研究所”（TIE）的设施进行翻修而来，将负责研究3D异质整合（3DHI）、堆栈和组合等多种材料和芯片类型，以提升美国在AI和高性能运算方面的能力。

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李飞飞回顾了自动驾驶的发展：从2005年斯坦福赢得DARPA挑战赛至今已近20年，深度学习虽然加速了算法进步，但自动驾驶依然未完全解决。而自动驾驶只是简单得多的机器人，仅需要在二维平面上避免碰撞，相比之下，机器人要在三维空间中操控物体，难度更高。

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李飞飞举例道，仅凭Rosalind Franklin拍摄的2D X射线衍射照片，James Watson和Francis Crick在脑海中构建3D模型，发现了DNA双螺旋结构。 在AI这件事上，每个人都有角色。她说自己走到哪里，都会被问这些问题： ...